直播時間：2023年4月14日（周五）20:00-21:30
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北京時間2023年4月14日晚八點，iCANX Talks 第139期將在iCANX平臺上線！本期我們邀請到清華大學馮雪教授進行分享！更多精彩，敬請期待！
【直播介紹】
Xue Feng
Tsinghua University
Flexible integrated circuits: design, manufacture and applications
【Abstract】
Flexible electronics technology refers to the integration of different materials and functional units on flexible substrates to form thin, flexible, deformable and reconfigurable electronic devices/systems. It subversively changes the rigid physical form of traditional electronic devices. The core of flexible electronics technology is the design, manufacture and reliability of flexible integrated devices.
柔性電子技術是指將不同的材料和功能單元集成在柔性襯底上，形成輕薄柔小、可變形、可重構的電子器件/系統(tǒng)。它顛覆性地改變了傳統(tǒng)電子器件剛性的物理形態(tài)。柔性電子技術的核心是柔性集成器件的設計、制造及可靠性。
This talk firstly introduces the design theory and manufacture of flexible integrated devices, including the evolution mechanism of semiconductor properties under deformation and the integration method of transfer printing on heterogeneous interfaces. For wafer level manufacturing of flexible integrated devices, nanometer diamond enhanced wafer grinding method is used, which can thin 4-12 inch wafer to 25 microns. With ultra-thin chips transfer and high energy laser beam slicing, the single flexible chips with independent function are obtained.
本次演講首先介紹了柔性集成器件設計理論和方法，包括形變下半導體性能演化機理、異質(zhì)界面轉(zhuǎn)印集成方法等。針對柔性集成器件的晶圓級制造，采用了納米金剛石強化晶圓研磨法，可將4～12英寸晶圓薄化到25微米，進行超薄晶圓轉(zhuǎn)移和高能激光束劃片，得到具有獨立功能的單個柔性芯片。
Then the flexible chips are picked up, transferred, interconnected, encapsulated and integrated, and finally the flexible integrated devices are formed. The first small test line of flexible integrated device manufacturing domestic and abroad and the CNAS standard testing and certification system have been established, and ultra-thin flexible chips, high-density packaging of flexible chips, high-precision SMT of flexible circuit boards and low-temperature silicone injection encapsulation have been realized from chip level to module level manufacturing. The above technologies greatly promote the innovation and development of flexible integrated devices and their applications in health care, intelligent perception, major equipment and other fields.
隨后進行柔性芯片拾取、轉(zhuǎn)移、互連、封裝和集成，最終形成柔性集成器件。建立了國際國內(nèi)首條柔性集成器件制造小試線和CNAS標準檢測認證體系，實現(xiàn)超薄柔性芯片、柔性芯片高密度封裝、柔性電路板高精度SMT和低溫硅膠注塑包封等從芯片級到模組級制造。以上技術極大推進了柔性集成器件的創(chuàng)新發(fā)展及其在健康醫(yī)療、智能感知、重大裝備等領域的應用。
【BIOGRAPHY】
Xue Feng, male, born in 1977, Professor of Tsinghua University, 973 Project Chief Scientist, currently director of Flexible Electronic Technology Laboratory of Tsinghua University, President of Zhejiang Tsinghua Flexible Electronic Technology Research Institute, etc.
馮雪，男，1977年生，清華大學長聘教授，國家973首席科學家、國家杰青等，現(xiàn)任清華大學柔性電子技術實驗室主任、浙江清華柔性電子技術研究院院長等。
Professor Feng Xue is committed to solid mechanics and flexible electronics technology. So far, he has published more than 260 SCI papers in Nat. Mater., Sci. Adv., Adv Mater. More than 190 national invention patents and 9 software Copyrights were authorized. He has won the Heliang Heli Foundation Science and Technology Innovation Award, China Youth Science and Technology Award, National Outstanding Scientist of Science and Technology, Qiushi Outstanding Youth Award of China Association for Science and Technology, etc. Ranked in 1st, he has won the first prize of Beijing Natural Science, the first prize of Technology Invention of the Ministry of Education and many other awards.
馮雪教授致力于固體力學與柔性電子技術研究，至今在Nat. Mater.、Sci. Adv.、Adv. Mater.、Natl. Sci. Rev.、JMPS等已發(fā)表SCI論文260余篇；授權國家發(fā)明專利190余項、自主軟件著作權9項；曾獲何梁何利基金科學與技術創(chuàng)新獎、中國青年科技獎、全國優(yōu)秀科技工作者、中國科協(xié)求是杰出青年獎等，以第一完成人獲北京市自然科學一等獎、教育部技術發(fā)明一等獎等獎等多項省部級和學會獎勵。
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